FAIRCHILD Semiconductor, represented by Arrow Electronics , has announced the USB1T11ABQ, a universal serial bus transceiver in micro leadframe packaging (MLP).
MLP occupies up to 84% less board space than comparable TSSOP and SOIC packages and brings USB 1.1 performance to mobile phones, digital cameras, PDAs, printers, set-top boxes and other space-constrained applications.
The USB1T11ABQ transceiver interfaces 5.0V or 3.3V standard or programmable logic to the USB physical layer, and supports both 12Mb/s full speed and 1.5Mb/s low-speed data transmission rates.
Input/output signal compatibility with the USB Implementers Forum's VHDL "Serial Interface Engine" specification helps engineers to design, modify and update USB 1.1 applications using off-the-shelf logic.
Utilising the JEDEC MO-220 (3mm squared) form factor, the MLP package eliminates coplanarity problems caused by flexing leads, as sometimes occurs with TSSOP and SOIC package designs.
Other MLP-derived design benefits include lower component height of 1.0mm for space-restricted portable designs, lower thermal resistance due to the component's centre DAP that connects directly to the die and PC board, and the device's 0.5mm pin-to-pin pitch that supports current manufacturability standards.