Agilent Technologies Inc. has released shipment of a complete and commercially available model parameter extraction tool for the advanced PSP complementary metal oxide semiconductor (CMOS) device model. For use with Agilent's Integrated Circuit Characterization and Analysis Program (IC-CAP) software platform, PSP Model Extraction Package takes advantage of the IC-CAP flexible architecture to accommodate the PSP model, which provides better accuracy than existing BSIM models for designs with small geometries and helps designers efficiently and accurately model CMOS devices.
IC-CAP is a modeling tool with a comprehensive extraction methodology for all three of the standard CMOS device models: BSIM3, BSIM4 and now PSP. As deep sub-micron devices continue to get smaller, the older BSIM models are no longer accurate enough for emerging analog and RF applications. The PSP model extraction package provides a tool that eliminates the need for custom-architected extraction routines and allows device modelers to efficiently transition to the PSP model, keeping pace with evolving devices and applications.
IC-CAP is a device modeling program that provides powerful characterisation and analysis capabilities for semiconductor modeling processes. Major semiconductor foundries around the globe use IC-CAP to accurately characterise foundry processes, resulting in reduced design cycles, decreased manufacturing costs and faster time-to-market for a variety of devices.
The flexible architecture of the IC-CAP software allows the addition of extraction packages, such as the new PSP package, as semiconductor applications evolve. Other available modeling tools that are built specifically around the BSIM4 model do not have this same flexibility, and are harder to adapt to changes and improvements in CMOS modeling.
With Agilent's new PSP Model Extraction Package and IC-CAP, designers can generate complete models based on the recent version of the Compact Modeling Council's standardised PSP model. The PSP package includes an easy-to-use interface for measurement collection, recommended extraction flows and model implementation. The package has been verified with 65-nm data from prominent CMOS foundries.
The PSP Model Extraction Package is part of the new IC-CAP release. The release also includes the Agilent HBT Model Extraction Package and instrument drivers for the new semiconductor test and measurement instruments.