Agilent Technologies have announced the 2009 release of Advanced Design System (ADS) for high-frequency/high-speed co-design of integrated circuits (IC), packages and boards. The ADS electronic design automation (EDA) helps circuit, package, board and system designers work with a single EDA platform to share simulation models and minimise design rework, costs and delays in the communications product design.
The 2009 ADS electronic design automation (EDA) co-design platform enables verification of high-frequency or high-speed system performance as soon as IC, package and PC board designs become available, either in real parts or in simulated models. With the common system-verification test benches in ADS 2009, designers can identify and correct component interactions that can negatively affect the ability to meet system performance specifications. Catching these interactions early in the design cycle prevents costly rework during final hardware integration.
The 2009 ADS electronic design automation (EDA) has the following applications:
- Designing advanced 4G LTE phones, where multimode/multiband compatibility with 3G, 2G, WiFi and Bluetooth(r) must be maintained in the size demanded by consumers
- Signal integrity analysis and fast eye-diagram optimisation of multigigabit, high-speed serial links, where layout geometry, pre-emphasis and equalisation are optimised for the lowest bit error rate and
- Aerospace-defence communication and radar system integration with military-specification components procured through long purchase cycles, where failure leads to project delay, cost overrun and eventual cancellation
Agilent Technologies’ wireless, high-speed and aerospace-defence system integration includes the co-design of their test and measurement instruments. The 2009 ADS electronic design automation (EDA) has capabilities for co-design with a variety of models including:
- X-parameters - Agilent Technologies innovation in accurate, non-linear measurement can be used directly in ADS simulation to accurately represent off-the-shelf components such as amplifiers and transistors
- 3D electromagnetic parameterised components representing metal shields, antenna radomes, absorbers, packages, interconnects, finite dielectric substrates and wire bonds
- transistor-level circuits on RFIC, MMIC, LTCC or laminate RF modules and PC boards
- behavioural models of all types, including Verilog-A/AMS, HDL, MATLAB(r), IBIS, C++ and neural networks
- netlists from HSPICE and Spectre
- measured signal stimulus and data from Agilent signal, network and logic analysers
- prebuilt simulation libraries and sources compliant with advanced wireless standards such as LTE, WiMedia and VWAN wireless HD with MIMO antenna characteristics
According to Agilent Technologies, prebuilt simulation libraries and standards-compliant sources mean that the IC and component design houses can collaborate with their system-integration customers to refine specifications and designs before committing to time-consuming hardware sampling and system integration trials.
The 2009 ADS electronic design automation (EDA) also interoperates with Cadence and Mentor back-end design platforms, allowing designers to import:
- Cadence Allegro PCB
- Advanced package designer and system-in-package physical design data for co-designing with active components
- Design rule check results from Cadence Assura, Mentor Calibre or Triquint MailDRC for viewing and correcting within the ADS environment