Manncorp has introduced new models in the popular Auto-Dip series of dip soldering systems featuring new levels of performance and reliability.
While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application.
Quick to set up and easy to use, the Auto-Dip systems are a valuable addition to electronics manufacturing facilities of any scale.
Key features of the touch-screen controlled Auto-Dip soldering systems include programmable preheat and dip height settings; adjustable, finger-type PCB holder that firmly grips the edges of the board throughout the soldering cycle; programmable speed, dip angle, lift angle, and dwell time ensuring consistent, high-quality solder joints; and interchangeable version of the popular, pin-type PCB holder also included to allow simultaneous soldering of multiple PCBs.
All Auto-Dip models have titanium solder pots with high-precision temperature controllers for use with lead-free SAC or SnPb solders. They also include an automatic dross skimmer and collection trough, and a programmable, 7-day, 24-hour startup timer. The largest model can handle large PCBs up to 600 x 350mm and its 100kg solder pot is still less than half the capacity of most small wave soldering systems, further lowering the comparative startup costs. A heavy-duty, steel mounting stand with levelling feet is also included for sturdy, safe installation.
The EZ-Flux 500A spray fluxing system is a handy accessory to the Auto-Dip systems and keeps the production area clean and residue-free.