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IoT a major driver for TSMC

Editorial
article image TSMC will be leveraging its 8-inch and 12-inch wafer fabs to produce devices like microcontrollers, image sensors, WiFi and Bluetooth sensors.

TSMC says Internet-of-Things-related products will be the main drivers for its mid-term future.

According to Taipei Times, TSMC will be leveraging its 8-inch and 12-inch wafer fabs to produce devices like microcontrollers, image sensors, WiFi and Bluetooth sensors.

The company expects the IoT business model to have matured in three to five years to become a major engine of growth.

TSMC is said to be accelerating its 16nm foundry plans, with FinFET wafers to start shipping in the first quarter of 2015.

For TSMC’s next step, it will be looking at 10nm or 7nm technologies, to start in 2017, which may use Extreme Ultraviolet processes.

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