JAPANESE company Tanaka Holdings and MEMS Core have finalised a joint development agreement for MEMS patterning using low-temperature bonding material.
The technology at the centre of the collaboration is a new type of photoresist-based pattern formation technology used to manufacture MEMS (microelectromechanical systems) devices.
This follows from previous R&D developments at Tanaka. In 2009, the firm found that it could apply heat and pressure using patterns of submicron gold particles to seal MEMS packaging. Following that, in 2013, it started supplying technology which allowed batch high definition screen printing of complex micropatterns on substrates using submicron gold particle paste.
MEMS uses diverse combination patterns which are increasing in complexity due to the use of 3D patterns combining microscopic moving parts with semiconductors on silicon substrates.
To enable faster R&D of MEMS products, the industry is increasingly looking for facilities that support the manufacture of small lots of very diverse MEMS products.
The technology agreement is expected to help in these areas since it enables new fabrication workflows from prototyping to implementation.
Tanaka will transfer its submicron gold particle patterning and sealing technology and equipment to MEMS CORE, which will use the technology to begin manufacturing prototypes and undertaking sealing for MEMS manufacturers on November 1.
Tanaka will also increase its focus on gold particle materials and concentrate on the modification and development of MEMS-centric materials.
The two companies' joint development organisation will enable the creation of a mounting centre for fab (manufacturing facility) functions in MEMS development and the consistent provision of products from material development to device mounting for MEMS manufacturers in the future.